The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 13, 2019

Filed:

Mar. 16, 2016
Applicant:

Lg Innotek Co., Ltd., Seoul, KR;

Inventors:

Jae Won Seo, Seoul, KR;

Hoe Jun Kim, Seoul, KR;

Bum Jin Yim, Seoul, KR;

Jun Hee Hong, Seoul, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/44 (2010.01); H01L 33/62 (2010.01); H01L 33/38 (2010.01); H01L 33/32 (2010.01); H01L 33/40 (2010.01); H01L 33/14 (2010.01);
U.S. Cl.
CPC ...
H01L 33/44 (2013.01); H01L 33/382 (2013.01); H01L 33/62 (2013.01); H01L 33/145 (2013.01); H01L 33/32 (2013.01); H01L 33/405 (2013.01);
Abstract

A light emitting device package, according to an embodiment, includes: a substrate; a light emitting structure that is disposed below the substrate and includes a first conductive type semiconductor layer, an active layer, and a second conductive type semiconductor layer; a first bonding pad connected with the first conductive type semiconductor layer while being embedded in a through-hole exposed the first conductive type semiconductor layer by passing through the active layer and the second conductive type semiconductor layer; a second bonding pad that is disposed below the second conductive type semiconductor layer while being spaced apart from the first bonding pad and is connected with the second conductive type semiconductor layer; a first insulation layer disposed on the lateral portion of the light emitting structure in the through-hole and on the lower inner edge of the light emitting structure; and a second insulation layer disposed between the first insulation layer and the first bonding pad in the through-hole.


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