The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 13, 2019

Filed:

Apr. 10, 2017
Applicants:

Stmicroelectronics (Crolles 2) Sas, Crolles, FR;

Commissariat a L'energie Atomique ET Aux Energies Alternatives, Paris, FR;

Inventors:

Frederic Boeuf, Le Versoud, FR;

Olivier Weber, Grenoble, FR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 29/04 (2006.01); H01L 29/78 (2006.01); H01L 21/02 (2006.01); H01L 21/84 (2006.01); H01L 27/12 (2006.01); H01L 29/06 (2006.01); H01L 21/762 (2006.01); H01L 21/8238 (2006.01); H01L 27/092 (2006.01); H01L 29/16 (2006.01); H01L 29/161 (2006.01);
U.S. Cl.
CPC ...
H01L 29/7847 (2013.01); H01L 21/02381 (2013.01); H01L 21/02422 (2013.01); H01L 21/02532 (2013.01); H01L 21/02639 (2013.01); H01L 21/02667 (2013.01); H01L 21/76264 (2013.01); H01L 21/76283 (2013.01); H01L 21/823807 (2013.01); H01L 21/84 (2013.01); H01L 27/092 (2013.01); H01L 27/12 (2013.01); H01L 27/1203 (2013.01); H01L 29/0611 (2013.01); H01L 29/0642 (2013.01); H01L 29/16 (2013.01); H01L 29/161 (2013.01); H01L 29/7838 (2013.01);
Abstract

A substrate of the silicon on insulator type includes a semi-conducting film disposed on a buried insulating layer which is disposed on an unstressed silicon support substrate. The semi-conducting film includes a first film zone of tensile-stressed silicon and a second film zone of tensile-relaxed silicon. Openings through the buried insulating layer permit access to the unstressed silicon support substrate under the first and second film zones. An N channel transistor is formed from the first film zone and a P channel transistor is formed from the second film zone. The second film zone may comprise germanium enriched silicon forming a compressive-stressed region.


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