The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 13, 2019

Filed:

May. 09, 2016
Applicant:

Osram Opto Semiconductors Gmbh, Regensburg, DE;

Inventor:

Markus Maute, Alteglofsheim, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/146 (2006.01); H01L 33/48 (2010.01); H01L 33/62 (2010.01); H01L 33/40 (2010.01); H01L 33/38 (2010.01); H01L 33/22 (2010.01); H01L 25/075 (2006.01); F21V 5/04 (2006.01); H01L 33/46 (2010.01); H01L 33/56 (2010.01);
U.S. Cl.
CPC ...
H01L 27/14625 (2013.01); F21V 5/04 (2013.01); H01L 25/0753 (2013.01); H01L 33/22 (2013.01); H01L 33/387 (2013.01); H01L 33/405 (2013.01); H01L 33/465 (2013.01); H01L 33/486 (2013.01); H01L 33/62 (2013.01); H01L 33/56 (2013.01);
Abstract

The invention relates to an optoelectronic semiconductor component () comprising the following —an optoelectronic semiconductor chip (), the lateral surfaces () and lower face () of which are at least partly covered by a molded body () that is electrically conductive and is designed to electrically contact the optoelectronic semiconductor chip (), —at least one via () which comprises an electrically conductive material and is laterally spaced from the semiconductor chip (), said via () completely passing through the molded body (), wherein the via () extends from an upper face () of the molded body () to a lower face () of the molded body (), —at least one insulating element () which is arranged within the molded body () between the via () and the semiconductor chip () and extends from the upper face () of the molded body () to the lower face () of the molded body (), and —an electrically conductive connection () which is connected to the semiconductor chip () and the via () in an electrically conductive manner.


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