The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 13, 2019

Filed:

Aug. 04, 2017
Applicant:

Automated Assembly Corporation, Lakeville, MN (US);

Inventors:

Kimmo Kyllonen, Shakopee, MN (US);

Robert Neuman, Cannon Falls, MN (US);

Assignee:

Automated Assembly Corporation, Lakeville, MN (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/52 (2006.01); H01L 23/00 (2006.01); B23K 20/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/85 (2013.01); B23K 20/007 (2013.01); H01L 24/48 (2013.01); H01L 24/78 (2013.01); H01L 24/97 (2013.01); H01L 2224/85205 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01029 (2013.01);
Abstract

A disclosed circuit arrangement includes a support structure having first and second posts. Electrically conductive round wire has a round cross-section, and a first portion is wrapped at least partially around the first post. A second portion of the wire extends in a straight line from a point on a perimeter of the first post to a point on a perimeter of the second post, and a third portion of the wire is wrapped at least partially around the second post. The second portion of the round wire defines one or more bond sites. An electronic device is electrically connected to the round wire at one of the one or more bond sites.


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