The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 13, 2019

Filed:

Jan. 18, 2017
Applicant:

Telefonaktiebolaget Lm Ericsson (Publ), Stockholm, SE;

Inventors:

Rob Maaskant, Göteborg, SE;

Alhassan Aljarosha, Borås, SE;

Ashraf Uz Zaman, Hisings Backa, SE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01P 3/12 (2006.01); H01P 5/02 (2006.01); H01Q 1/22 (2006.01); H01L 23/66 (2006.01); H01P 1/207 (2006.01); H01P 11/00 (2006.01); H01P 3/123 (2006.01); H01Q 13/02 (2006.01); H01Q 13/10 (2006.01);
U.S. Cl.
CPC ...
H01L 23/66 (2013.01); H01P 3/121 (2013.01); H01P 3/123 (2013.01); H01P 5/024 (2013.01); H01P 11/002 (2013.01); H01Q 1/2283 (2013.01); H01Q 13/02 (2013.01); H01Q 13/10 (2013.01); H01L 2223/6633 (2013.01); H01L 2223/6683 (2013.01); H01P 1/207 (2013.01);
Abstract

The present invention relates to a transition arrangement () comprising a transition between a substrate integrated waveguide, SIW, () of a circuit arrangement and a waveguide and/or antenna structure (). It comprises a first conducting plate () and a second conducting plate (). The SIW () is arranged on said first conducting plate, and an impedance matching structure () is connected to the second conducting plate. For a transition between the SIW () and the waveguide structure, the impedance matching structure () is extended with an open circuit λg/4 stub () for inverting the impedance to effectively provide a short-circuit connection, thereby electromagnetically coupling the EM-field between the SIW and the impedance matching structure (), which is so arranged that, when the first and second conducting plates are interconnected, or merely assembled in a contactless manner in the case of gap structures, the open circuit λg/4 stub () is disposed above the SIW without any galvanic contact between the SIW and the impedance matching structure () and between the SIW () and the λg/4 stub (), providing a planar, contactless transition.


Find Patent Forward Citations

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Maaskant, Rob. (2019). Transition arrangement comprising a contactless transition or connection between an siw and a waveguide or an antenna (U.S. Patent No. 10381317). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10381317

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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