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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10381314 B1

PDFFull Text
Date of Patent:
Aug. 13, 2019

Filed:

Feb. 27, 2014

Method of manufacturing mounting member and method of manufacturing electronic component

Applicant:

Canon Kabushiki Kaisha, Tokyo, JP;

Inventors:

Takanori Suzuki, Tokyo, JP;

Kazuya Notsu, Yokohama, JP;

Ryuji Oyama, Oita, JP;

Assignee:

Canon Kabushiki Kaisha, Tokyo, JP;

Attorney:

Canon U.S.A., Inc. IP Division

Primary Examiner:

Peter Dungba Vo

Assistant Examiner:

Azm A Parvez

Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/10 (2006.01); H01L 23/055 (2006.01); H01L 23/32 (2006.01); H01L 21/50 (2006.01);
U.S. Cl.
CPC ...
H01L 23/562 (2013.01); H01L 21/50 (2013.01); H01L 23/055 (2013.01); H01L 23/10 (2013.01); H01L 23/32 (2013.01); H01L 24/73 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/1531 (2013.01); H01L 2924/15153 (2013.01); H01L 2924/16195 (2013.01); H01L 2924/3511 (2013.01); Y10T 29/49002 (2015.01);
Abstract

The method of the invention includes: placing a base member and a frame member having a thermal expansion coefficient different from a thermal expansion coefficient of the base member in a state in which the base member is stacked with the frame member and a thermosetting adhesive agent is interposed between the base member and the frame member; adhering the base member and the frame member by heating the base member, the frame member, and the adhesive agent from the state to a temperature equal to or higher than a curing temperature of the adhesive agent; and cooling the base member and the frame member from the curing temperature. The frame member in the state is warped so that a flatness error of the frame member after having been cooled becomes smaller than that in a case where the frame member is flat in the state.

Find Patent Forward Citations

Suzuki, Takanori. (2019). Method of manufacturing mounting member and method of manufacturing electronic component (U.S. Patent No. 10381314). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10381314

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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