The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 13, 2019
Filed:
Jul. 26, 2017
Applicant:
Fujitsu Limited, Kawasaki-shi, Kanagawa, JP;
Inventors:
Shinichi Hirose, Yokohama, JP;
Daiyu Kondo, Atsugi, JP;
Assignee:
FUJITSU LIMITED, Kawasaki, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/30 (2006.01); H01L 23/373 (2006.01); F28F 13/18 (2006.01); F28F 21/02 (2006.01); H01L 21/48 (2006.01); H01L 23/367 (2006.01); H01L 23/043 (2006.01); H01L 23/10 (2006.01); B82Y 30/00 (2011.01); H01L 23/053 (2006.01); F28F 13/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3737 (2013.01); F28F 13/18 (2013.01); F28F 21/02 (2013.01); H01L 21/481 (2013.01); H01L 23/3675 (2013.01); H01L 23/373 (2013.01); B82Y 30/00 (2013.01); F28F 2013/006 (2013.01); F28F 2255/20 (2013.01); H01L 23/043 (2013.01); H01L 23/053 (2013.01); H01L 23/10 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/73253 (2013.01);
Abstract
A method of manufacturing an electronic device includes: placing a resin film on a component; and while heating the resin film to be softened, pressing end portions of a plurality of carbon nanotubes against the softened resin film to bring the end portions into contact with the component, and causing the softened resin film to climb up side surfaces of the carbon nanotubes.