The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 13, 2019

Filed:

Aug. 07, 2017
Applicant:

Delta Electronics (Shanghai) Co., Ltd., Shanghai, CN;

Inventors:

Shou-Yu Hong, Shanghai, CN;

Gan-Yu Zhou, Shanghai, CN;

Jian-Hong Zeng, Shanghai, CN;

Zhen-Qing Zhao, Shanghai, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/373 (2006.01); H01L 23/36 (2006.01); H01L 23/498 (2006.01); H01L 23/433 (2006.01); H01L 23/495 (2006.01); H01L 25/07 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3735 (2013.01); H01L 23/36 (2013.01); H01L 23/4334 (2013.01); H01L 23/49537 (2013.01); H01L 23/49562 (2013.01); H01L 23/49568 (2013.01); H01L 23/49575 (2013.01); H01L 23/49811 (2013.01); H01L 23/49833 (2013.01); H01L 25/072 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/181 (2013.01); H05K 1/0265 (2013.01); H05K 2201/10166 (2013.01);
Abstract

A power module is disclosed. The power module includes a first substrate, a first metal layer, at least one conductive structure and at least one power device. The first metal layer is disposed on the first substrate. The first metal layer has a first thickness d. The first thickness dsatisfies: 5 μm≤d≤50 μm. The conductive structure is disposed at a position different to the first metal layer on the first substrate. The conductive structure has a second thickness d. The second thickness dsatisfies: d≥100 μm. The power device is disposed on the first substrate, the first metal layer or the conductive structure. The driving electrode of the power device is electrically connected to the first metal layer. The power electrode of the power device is electrically coupled to the conductive structure.


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