The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 13, 2019
Filed:
Jun. 02, 2017
Applicant:
Mitsubishi Chemical Corporation, Chiyoda-ku, JP;
Inventor:
Kazumasa Oota, Mie, JP;
Assignee:
MITSUBISHI CHEMICAL CORPORTION, Chiyoda-ku, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/29 (2006.01); H01L 23/31 (2006.01); C08G 59/68 (2006.01); C08G 59/62 (2006.01); C08G 59/24 (2006.01);
U.S. Cl.
CPC ...
H01L 23/295 (2013.01); C08G 59/245 (2013.01); C08G 59/621 (2013.01); C08G 59/688 (2013.01); H01L 23/31 (2013.01); H01L 2924/0002 (2013.01);
Abstract
The present invention relates to a tetramethylbiphenol type epoxy resin having a content of a sodium ion of 1 to 12 ppm which is determined by measurement by the atomic absorption spectrometry using a solution wherein a sample is dissolved in N-methylpyrrolidone.
Quick Actions:
Oota, Kazumasa. (2019). Tetramethylbiphenol type epoxy resin, epoxy resin composition, cured product, and semiconductor sealing material (U.S. Patent No. 10381282). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10381282
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile