The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 13, 2019

Filed:

Dec. 04, 2017
Applicant:

Arizona Board of Regents on Behalf of Arizona State University, Scottsdale, AZ (US);

Inventors:

Emmett Howard, Tempe, AZ (US);

Nicholas Munizza, Gilbert, AZ (US);

Paul Yee, Chandler, AZ (US);

Zachary Hartke, Chandler, AZ (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01); H01L 21/20 (2006.01); H01L 21/02 (2006.01); H01L 51/00 (2006.01); H01L 21/48 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
H01L 21/2007 (2013.01); H01L 21/02381 (2013.01); H01L 21/02565 (2013.01); H01L 21/4857 (2013.01); H01L 21/6835 (2013.01); H01L 51/003 (2013.01); H01L 51/0097 (2013.01); H01L 2221/6835 (2013.01); H01L 2221/68345 (2013.01); H01L 2221/68381 (2013.01); Y02E 10/549 (2013.01);
Abstract

Some embodiments include a method. The method can include: providing a carrier substrate; providing a first bond promoting layer over the carrier substrate; providing a second bond promoting layer over the carrier substrate; and depositing a first device substrate over the carrier substrate, the first bond promoting layer, and the second bond promoting layer. The first device substrate can be configured to bond to the carrier substrate with a first device substrate-carrier substrate adhesion strength. Meanwhile, depositing the first device substrate can include: bonding the first device substrate to the first bond promoting layer, the first device substrate bonding to the first bond promoting layer with a first device substrate-first bond promoting layer adhesion strength greater than the first device substrate-carrier substrate adhesion strength; and coupling the first device substrate to the carrier substrate. Other embodiments of related methods and devices are also disclosed.


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