The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 13, 2019

Filed:

Oct. 07, 2016
Applicant:

Industrial Technology Research Institute, Hsinchu, TW;

Inventors:

Chih-Chia Chang, Hsinchu County, TW;

Kuang-Jung Chen, Hsinchu County, TW;

Yi-Chuan Lu, Kinmen County, TW;

Kai-Ming Chang, New Taipei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 3/041 (2006.01);
U.S. Cl.
CPC ...
G06F 3/0412 (2013.01); G06F 2203/04102 (2013.01); G06F 2203/04103 (2013.01); G06F 2203/04107 (2013.01); G06F 2203/04111 (2013.01); G06F 2203/04112 (2013.01);
Abstract

In an embodiment of the disclosure, a touch-sensing display panel includes a substrate, connection electrodes, a touch-sensing device layer, a buffer layer, a display device, and conductive vias. The substrate has a display area and a non-display area connecting the display area. The connection electrodes are located on the non-display area of the substrate. The touch-sensing device layer is located on the substrate. The buffer layer covers the touch-sensing device layer. The display device including a first electrode layer, a second electrode layer, and a display medium layer is disposed on the buffer layer and corresponds to the display area. The first electrode layer and the second electrode layer extend from the display area to the non-display area. The conductive vias penetrate the buffer layer and correspond to the non-display area. The first electrode layer and the second electrode layer are electrically connected to the connection electrodes via the conductive vias.


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