The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 13, 2019
Filed:
Dec. 25, 2015
Applicant:
Fujikura Ltd., Tokyo, JP;
Inventor:
Takaharu Hondo, Chiba, JP;
Assignee:
FUJIKURA LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 3/041 (2006.01); H05K 3/20 (2006.01); H05K 3/38 (2006.01); G06F 3/044 (2006.01); H05K 1/02 (2006.01); H05K 1/09 (2006.01); H05K 3/12 (2006.01);
U.S. Cl.
CPC ...
G06F 3/041 (2013.01); H05K 3/20 (2013.01); H05K 3/207 (2013.01); H05K 3/386 (2013.01); G06F 3/044 (2013.01); G06F 2203/04103 (2013.01); H05K 1/0274 (2013.01); H05K 1/092 (2013.01); H05K 3/1275 (2013.01); H05K 2201/0108 (2013.01); H05K 2201/09681 (2013.01); H05K 2201/09827 (2013.01); H05K 2203/0113 (2013.01); H05K 2203/0502 (2013.01);
Abstract
A wiring body includes an adhesive layer and a conductor pattern bonded to the adhesive layer. A surface roughness of an adhesive surface in the conductor pattern bonded to the adhesive layer is rougher than a surface roughness of another surface, which is a surface of the conductor pattern except for the adhesive surface in the conductor pattern.
Hondo, Takaharu. (2019). Wiring body, wiring board, touch sensor and method for producing wiring body (U.S. Patent No. 10379645). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10379645
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile