The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 13, 2019

Filed:

Sep. 01, 2017
Applicant:

Kabushiki Kaisha Toshiba, Minato-ku, Tokyo, JP;

Inventors:

Michihiko Nishigaki, Kawasaki Kanagawa, JP;

Yutaka Onozuka, Yokohama Kanagawa, JP;

Shouhei Kousai, Yokohama Kanagawa, JP;

Yosuke Akimoto, Yokohama Kanagawa, JP;

Miyu Nagai, Yokohama Kanagawa, JP;

Kaita Imai, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B01L 3/00 (2006.01); G03F 7/11 (2006.01); G03F 7/20 (2006.01); G03F 7/32 (2006.01); G01N 21/05 (2006.01); G01N 21/64 (2006.01); G03F 7/075 (2006.01); H01L 21/027 (2006.01);
U.S. Cl.
CPC ...
G03F 7/0757 (2013.01); B01L 3/5085 (2013.01); G03F 7/11 (2013.01); G03F 7/2004 (2013.01); G03F 7/325 (2013.01); H01L 21/0274 (2013.01); B01L 2200/12 (2013.01); B01L 2300/0636 (2013.01); B01L 2300/0663 (2013.01); B01L 2300/0829 (2013.01); B01L 2300/0851 (2013.01); G01N 21/6486 (2013.01); G01N 2021/054 (2013.01); G01N 2021/6482 (2013.01);
Abstract

According to one embodiment, a pattern forming method includes forming a resist pattern on a substrate, forming a first silicone resin layer so as to bury the resist pattern on the substrate, pressing a film on the surface of the first silicone resin layer to adhere the film thereto, curing the first silicone resin layer after the adhesion of the film, peeling the film from the first silicone resin layer before or after the curing of the first silicone resin layer, and removing the resist pattern after the peeling of the film.


Find Patent Forward Citations

Loading…