The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 13, 2019

Filed:

Aug. 16, 2017
Applicant:

Seoul Semiconductor Co., Ltd., Ansan-si, KR;

Inventors:

Jang Weon Lee, Ansan-si, KR;

Sung Ki Hwang, Ansan-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F21V 5/04 (2006.01); F21V 5/08 (2006.01); G02B 19/00 (2006.01); F21Y 115/10 (2016.01); F21V 5/00 (2018.01); F21V 17/00 (2006.01); F21V 17/06 (2006.01); F21W 131/103 (2006.01);
U.S. Cl.
CPC ...
F21V 5/04 (2013.01); F21V 5/08 (2013.01); G02B 19/0014 (2013.01); G02B 19/0061 (2013.01); F21V 5/007 (2013.01); F21V 17/005 (2013.01); F21V 17/06 (2013.01); F21W 2131/103 (2013.01); F21Y 2115/10 (2016.08);
Abstract

A light emitting module includes a substrate, a light emitting diode chip, and a lens. The light emitting diode chip is disposed on the substrate. The lens is coupled to the substrate and covers the light emitting diode chip. The lens includes a light incident surface and a light exit surface. The light incident surface receives light from the light emitting diode chip. The light exit surface outputs the light from the lens. The light incident surface includes a concave light incident surface and a convex light incident surface. The concave light incident surface overlaps the light emitting diode. The convex light incident surface extends from the concave light incident surface.


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