The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 13, 2019
Filed:
Dec. 22, 2015
Applicant:
Sabic Global Technologies B.v., Bergen op Zoom, NL;
Assignee:
SABIC GLOBAL TECHNOLOGIES B.V., Bergen op Zoom, NL;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 79/08 (2006.01); C08G 73/10 (2006.01); C08K 3/04 (2006.01); C08K 3/28 (2006.01); C09D 179/08 (2006.01); H05K 1/03 (2006.01); C08L 71/00 (2006.01); C08L 81/06 (2006.01); C08K 3/38 (2006.01);
U.S. Cl.
CPC ...
C08G 73/1071 (2013.01); C08G 73/1064 (2013.01); C08K 3/04 (2013.01); C08K 3/28 (2013.01); C08L 71/00 (2013.01); C08L 79/08 (2013.01); C08L 81/06 (2013.01); C09D 179/08 (2013.01); H05K 1/0373 (2013.01); C08K 2003/385 (2013.01); H05K 2201/0154 (2013.01); H05K 2201/0209 (2013.01);
Abstract
A polyetherimide composition is disclosed including a polyetherimide sulfone having a glass transition temperature of 240 to 320 C, preferably 245 to 312 C, and a particulate, thermally conductive filler composition. A layer of the polyetherimide composition resists deformation as determined by IPC method TM-650 when subjected to a lead-free solder reflow process at a temperature of greater than or equal to 260 C, preferably 260 to 350 C. A layer including the polyetherimide composition further has a thermal conductivity of 2.5 to 15 W/mK, preferably 3 to 12 W/mK, as determined in accordance with ISO 22007-2:2008.