The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 13, 2019

Filed:

Jun. 20, 2017
Applicant:

Seiko Epson Corporation, Tokyo, JP;

Inventors:

Motoki Takabe, Shiojiri, JP;

Eiju Hirai, Azumino, JP;

Munehide Saimen, Suwa, JP;

Yasuyuki Matsumoto, Azumino, JP;

Shuichi Tanaka, Chino, JP;

Tsuyoshi Yoda, Matsumoto, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/14 (2006.01); B41J 2/16 (2006.01);
U.S. Cl.
CPC ...
B41J 2/14201 (2013.01); B41J 2/14072 (2013.01); B41J 2/1607 (2013.01); B41J 2/14233 (2013.01); B41J 2002/14491 (2013.01);
Abstract

A MEMS device includes a wire that is formed of a conductive portion embedded into a recess opened in a first face of a substrate and a bump electrode that is electrically connected to the wire. A total width, in a second direction intersecting a first direction along which the wire extends on the first face, of an opening of the recess in a connection region where the wire and the bump electrode are electrically connected to each other is narrower than a width, in the second direction, of an opening of the recess in a region outside the connection region.


Find Patent Forward Citations

Loading…