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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10377089 B1

PDFFull Text
Date of Patent:
Aug. 13, 2019

Filed:

Aug. 09, 2017

Bonded part, manufacturing method of bonded part, ink tank, and ink cartridge

Applicant:

Canon Kabushiki Kaisha, Tokyo, JP;

Inventors:

Hiroki Wakayama, Kawasaki, JP;

Motohiro Watanabe, Saitama, JP;

Toshiyuki Tomita, Yokohama, JP;

Assignee:

Canon Kabushiki Kaisha, Tokyo, JP;

Attorney:

Canon U.S.A., Inc. IP Division

Primary Examiner:

Stephen J Castellano

Int. Cl.
CPC ...
B65D 6/02 (2006.01); B29C 65/00 (2006.01); B29C 45/00 (2006.01); B41J 2/175 (2006.01); B29C 33/00 (2006.01); B29C 33/40 (2006.01);
U.S. Cl.
CPC ...
B29C 66/71 (2013.01); B29C 45/0062 (2013.01); B29C 66/532 (2013.01); B29C 66/7252 (2013.01); B29C 66/7292 (2013.01); B41J 2/175 (2013.01); B41J 2/17513 (2013.01); B41J 2/17553 (2013.01); B41J 2/17559 (2013.01); B29C 33/0022 (2013.01); B29C 33/40 (2013.01); B29C 66/49 (2013.01);
Abstract

In order to provide a bonded part capable of reducing deformation caused by injection pressure of bonding resin and preventing an increase in cost, the bonded part includes a first part, a second part, and a third part, wherein the first part includes a wall portion and a hollow portion surrounded by the wall portion, wherein a first shape portion formed of bonding resin is arranged at a position between the second part and the wall portion, wherein a second shape portion formed of the bonding resin is arranged at a position between the wall portion and the third part, and wherein a third shape portion formed of the bonding resin which connects the first shape portion and the second shape portion is arranged on the wall portion.

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Wakayama, Hiroki. (2019). Bonded part, manufacturing method of bonded part, ink tank, and ink cartridge (U.S. Patent No. 10377089). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10377089

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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