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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10376995 B1

PDFFull Text
Date of Patent:
Aug. 13, 2019

Filed:

Dec. 12, 2014

Tin-antimony-based high temperature solder for downhole components

Applicant:

Schlumberger Technology Corporation, Sugar Land, TX (US);

Inventors:

Francis Dupouy, Stonehouse, GB;

Mark Kostinovsky, Houston, TX (US);

Suriyakan Vongtragool Kleitz, Houston, TX (US);

Chandradip Pravinbhai Patel, Stafford, TX (US);

Assignee:

SCHLUMBERGER TECHNOLOGY CORPORATION, Sugar Land, TX (US);

Attorney:
Primary Examiner:

Zakiya W Bates

Int. Cl.
CPC ...
B23K 35/26 (2006.01); E21B 10/25 (2006.01); B23K 35/02 (2006.01); E21B 17/00 (2006.01); B23K 1/00 (2006.01); C22C 13/02 (2006.01); E21B 47/00 (2012.01); E21B 47/12 (2012.01); E21B 41/00 (2006.01); B23K 101/00 (2006.01);
U.S. Cl.
CPC ...
B23K 35/262 (2013.01); B23K 1/0008 (2013.01); B23K 35/025 (2013.01); B23K 35/0222 (2013.01); B23K 35/0244 (2013.01); B23K 35/26 (2013.01); C22C 13/02 (2013.01); E21B 17/00 (2013.01); E21B 41/00 (2013.01); E21B 47/00 (2013.01); E21B 47/12 (2013.01); B23K 2101/002 (2018.08);
Abstract

A downhole tool conveyable within a wellbore extending into a subterranean formation, wherein the downhole tool comprises a first component, a second component, and a solder electrically and mechanically coupling the first and second components, wherein the solder comprises or consists of: from 9.6 to 10.2 weight % of antimony; from 0.01 to 0.25 weight % of manganese; and tin.

Find Patent Forward Citations

Dupouy, Francis. (2019). Tin-antimony-based high temperature solder for downhole components (U.S. Patent No. 10376995). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10376995

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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