The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 13, 2019

Filed:

Mar. 22, 2016
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Ira L. Allen, Dallas, TX (US);

Gregory J. Boss, Saginaw, MI (US);

Lawrence A. Clevenger, Rhinebeck, NY (US);

Andrew R. Jones, Round Rock, TX (US);

Kevin C. McConnell, Austin, TX (US);

John E. Moore, Jr., Brownsburg, IN (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B65D 83/04 (2006.01); A61J 3/00 (2006.01); A61J 7/00 (2006.01); B65B 7/00 (2006.01); B65D 75/32 (2006.01);
U.S. Cl.
CPC ...
A61J 3/00 (2013.01); A61J 7/0076 (2013.01); B65B 7/00 (2013.01); A61J 2200/70 (2013.01); A61J 2205/60 (2013.01); B65D 75/327 (2013.01); B65D 83/0463 (2013.01);
Abstract

A method includes micro-machining a cavity within a substrate, filling the cavity with a medication, forming a sealing layer over the cavity, micro-machining a cantilevered beam from a layer of material, the cantilevered beam comprising a tip for puncturing the sealing layer, and attaching the cantilevered beam to the substrate such that moving the cantilevered beam toward the substrate enables the tip to puncture the sealing layer. A computer program product corresponding to the method is also disclosed. An apparatus includes a substrate having a cavity micro-machined therein, a sealing layer formed over the cavity, a medication disposed within the cavity, a cantilevered beam micro-machined from a layer of material, the cantilevered beam comprising a tip for puncturing the sealing layer, and the cantilevered beam attached to the substrate and disposed to enable the tip to puncture the sealing layer when the cantilevered beam is moved towards the substrate.


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