The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 06, 2019

Filed:

Jan. 23, 2018
Applicant:

Honeywell International Inc., Morris Plains, NJ (US);

Inventors:

Chad Fertig, Bloomington, MN (US);

Karl D. Nelson, Plymouth, MN (US);

Joshua Dorr, Golden Valley, MN (US);

Steven Tin, Plymouth, MN (US);

Neil A Krueger, Saint Paul, MN (US);

Assignee:

Honeywell International Inc., Morris Plains, NJ (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
F28F 13/00 (2006.01); H01L 23/373 (2006.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20281 (2013.01); H01L 23/373 (2013.01); H05K 7/20218 (2013.01); H05K 7/20263 (2013.01); H05K 7/20272 (2013.01); F28F 2013/008 (2013.01);
Abstract

Systems and methods for zero power automatic thermal regulation are provided. In one embodiment, a method for passive thermal management comprises: establishing thermal conductivity between a self-heating electronic device and a cooling fluid held within a fluid reservoir via a thermal interface; using thermally controlled expansion of the cooling fluid, controlling a length of a column of the cooling fluid extending into at least one channel extending from the fluid reservoir, wherein the channel provides a non-recirculating path for the cooling fluid to expand into, and wherein the length of a column of the cooling fluid is thermally controlled using heat absorbed by the cooling fluid from the self-heating electronic device; and selectively establishing a primary heat path between the electronic device and a heat sink interface thermally coupled to an external environment as a function of the length of the column of the cooling fluid within the channel.


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