The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 06, 2019

Filed:

Dec. 15, 2016
Applicant:

Advanced Micro Devices, Inc., Sunnyvale, CA (US);

Inventors:

Yuan Li, San Diego, CA (US);

James R. Foppiano, Austin, TX (US);

Jonathan P. Dowling, Austin, TX (US);

Gerald J. Merits, Austin, TX (US);

Manjunath Shivappa, Austin, TX (US);

Wasim I. Ullah, Austin, TX (US);

Claude Hilbert, Austin, TX (US);

Assignee:

Advanced Micro Devices, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01P 3/08 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 3/40 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0245 (2013.01); H01P 3/081 (2013.01); H05K 1/0251 (2013.01); H05K 1/0298 (2013.01); H05K 1/116 (2013.01); H05K 3/4038 (2013.01);
Abstract

Various circuit boards and systems are disclosed. In one aspect a system includes a circuit board and n differential signal via pairs. Each of the n differential signal via pairs has a first signal via and a second signal via and an electrical wall between the first signal via and the second signal via. There is a midline between every two adjacent differential via pairs. There are n ground return path vias. Each of the n ground return path vias is positioned substantially along one of the midlines and not on one of the electrical walls.


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