The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 06, 2019

Filed:

Mar. 29, 2017
Applicant:

Tdk Corporation, Tokyo, JP;

Inventors:

Takuya Murashige, Tokyo, JP;

Masahide Ohnishi, Tokyo, JP;

Masayuki Sugasawa, Tokyo, JP;

Masayuki Kobayashi, Tokyo, JP;

Assignee:

TDK CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H02J 50/60 (2016.01); H02J 50/10 (2016.01); H01F 27/02 (2006.01); H01F 27/28 (2006.01); H01F 38/14 (2006.01); H02J 7/02 (2016.01); H02J 50/70 (2016.01); B60L 53/12 (2019.01); H01F 27/36 (2006.01);
U.S. Cl.
CPC ...
H02J 50/60 (2016.02); B60L 53/12 (2019.02); H01F 27/02 (2013.01); H01F 27/2823 (2013.01); H01F 38/14 (2013.01); H02J 7/025 (2013.01); H02J 50/10 (2016.02); H02J 50/70 (2016.02); H01F 27/365 (2013.01);
Abstract

A coil unit provided on a ground side, including a coil, at least one sensor for detecting an object existing above or around the coil unit, a housing for accommodating the coil and the at least one sensor, wherein, the housing is provided with a dividing plate and at least one pillar for maintaining the internal space of the space for sensor, the dividing plate divides the space into a space for coil and a space for sensor located vertically above the space for coil, the space for coil is for accommodating the coil and the space for sensor is for accommodating the at least one sensor, and the at least one sensor is disposed on the dividing plate without contacting with an upper inner surface portion of the housing in the space for sensor.


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