The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 06, 2019
Filed:
Dec. 25, 2014
Applicant:
Zeon Corporation, Tokyo, JP;
Inventors:
Satoshi Tazaki, Tokyo, JP;
Hiroyasu Inoue, Tokyo, JP;
Atsushi Ishiguro, Tokyo, JP;
Yohei Koide, Tokyo, JP;
Assignee:
ZEON CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 3/08 (2006.01); B32B 27/28 (2006.01); B32B 7/10 (2006.01); B32B 7/04 (2019.01); B32B 27/32 (2006.01); B32B 27/08 (2006.01); B32B 7/12 (2006.01); B32B 7/02 (2019.01); H01L 51/52 (2006.01); H01L 29/786 (2006.01); B32B 27/30 (2006.01); G02B 5/30 (2006.01); H01L 27/12 (2006.01);
U.S. Cl.
CPC ...
H01L 51/524 (2013.01); B32B 3/08 (2013.01); B32B 7/02 (2013.01); B32B 7/04 (2013.01); B32B 7/10 (2013.01); B32B 7/12 (2013.01); B32B 27/08 (2013.01); B32B 27/28 (2013.01); B32B 27/302 (2013.01); B32B 27/32 (2013.01); G02B 5/3083 (2013.01); H01L 27/1248 (2013.01); H01L 29/786 (2013.01); B32B 2250/03 (2013.01); B32B 2307/40 (2013.01); B32B 2307/416 (2013.01); B32B 2307/418 (2013.01); B32B 2307/42 (2013.01); B32B 2307/51 (2013.01); B32B 2307/54 (2013.01); B32B 2405/00 (2013.01); B32B 2457/20 (2013.01); B32B 2457/206 (2013.01); B32B 2581/00 (2013.01); H01L 51/5281 (2013.01);
Abstract
A sealing film including a substrate film, a sealing layer, and an adhesive layer in this order, wherein the sealing film has a tensile elastic modulus of equal to or higher than 1,000 MPa, and retardation of a layer portion provided at the sealing layer side relative to the substrate film in the sealing film after sealing is equal to or smaller than 20 nm.