The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 06, 2019

Filed:

Dec. 19, 2017
Applicants:

Tsinghua University, Beijing, CN;

Hon Hai Precision Industry Co., Ltd., New Taipei, TW;

Inventors:

Yu-Dan Zhao, Beijing, CN;

Xiao-Yang Xiao, Beijing, CN;

Ying-Cheng Wang, Beijing, CN;

Yuan-Hao Jin, Beijing, CN;

Tian-Fu Zhang, Beijing, CN;

Qun-Qing Li, Beijing, CN;

Assignees:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/06 (2006.01); H01L 29/16 (2006.01); H01L 29/20 (2006.01); H01L 29/24 (2006.01); H01L 29/49 (2006.01); H01L 51/00 (2006.01); H01L 51/05 (2006.01); H01L 51/10 (2006.01); H01L 29/417 (2006.01); H01L 29/775 (2006.01); H01L 29/872 (2006.01); B82Y 10/00 (2011.01);
U.S. Cl.
CPC ...
H01L 51/0579 (2013.01); B82Y 10/00 (2013.01); H01L 29/0673 (2013.01); H01L 29/0676 (2013.01); H01L 29/24 (2013.01); H01L 29/4908 (2013.01); H01L 29/872 (2013.01); H01L 51/0096 (2013.01); H01L 51/055 (2013.01); H01L 51/0558 (2013.01); H01L 51/102 (2013.01); H01L 29/16 (2013.01); H01L 29/1608 (2013.01); H01L 29/20 (2013.01); H01L 29/417 (2013.01); H01L 29/775 (2013.01); H01L 51/0005 (2013.01); H01L 51/0048 (2013.01); H01L 51/0545 (2013.01);
Abstract

A thin film transistor includes a gate, an insulating medium layer and a Schottky diode. The Schottky diode includes a first electrode, a second electrode and a semiconducting structure. The first electrode is located on the surface of the insulating medium layer and includes a first metal layer and a second metal layer. The second electrode is located on the surface of the insulating medium layer and includes a third metal layer and a fourth metal layer. The semiconductor structure includes a first end and a second end. The first end is sandwiched by the first metal layer and the second metal layer, the second end is sandwiched by the third metal layer and the fourth metal layer. The semiconductor structure includes a carbon nanotube structure.


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