The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 06, 2019

Filed:

Sep. 29, 2016
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Jeehwan Kim, White Plains, NY (US);

Ning Li, White Plains, NY (US);

Devendra K. Sadana, Pleasantville, NY (US);

Tze-bin Song, Los Angeles, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 51/00 (2006.01); H01L 51/52 (2006.01); H01L 51/56 (2006.01); H01L 51/50 (2006.01);
U.S. Cl.
CPC ...
H01L 51/003 (2013.01); H01L 51/0024 (2013.01); H01L 51/5206 (2013.01); H01L 51/5212 (2013.01); H01L 51/5215 (2013.01); H01L 51/5228 (2013.01); H01L 51/5231 (2013.01); H01L 51/5234 (2013.01); H01L 51/56 (2013.01); H01L 51/0036 (2013.01); H01L 51/0037 (2013.01); H01L 51/5088 (2013.01); H01L 51/5092 (2013.01);
Abstract

A method for fabricating an optoelectronic device includes forming an adhesion layer on a substrate, forming a material layer on the adhesion layer and applying release tape to the material layer. The substrate is removed at the adhesion layer by mechanically yielding the adhesion layer. A conductive layer is applied to the material layer on a side opposite the release tape to form a transfer substrate. The transfer substrate is transferred to a target substrate to join the target substrate to the conductive layer of the transfer substrate. The release tape is removed from the material layer to form a top emission optoelectronic device.


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