The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 06, 2019
Filed:
Jan. 18, 2018
Applicant:
Globalfoundries Singapore Pte Ltd, Singapore, SG;
Inventors:
Assignee:
GLOBALFOUNDRIES Inc., Grand Cayman, KY;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/30 (2006.01); H01L 27/22 (2006.01); H01L 43/12 (2006.01); H01L 43/08 (2006.01);
U.S. Cl.
CPC ...
H01L 43/12 (2013.01); H01L 27/228 (2013.01); H01L 21/3003 (2013.01); H01L 43/08 (2013.01);
Abstract
One illustrative method disclosed herein includes forming an MRAM memory array and a plurality of peripheral circuits for an integrated circuit product above a semiconductor substrate, forming a patterned layer of a metal-containing shielding material above the substrate, the patterned layer of metal-containing shielding material covering the MRAM memory array while leaving an area above the plurality of peripheral circuits exposed, and, with the patterned layer of metal-containing shielding material in position, performing a silicon dangling bond passivation anneal process on the integrated circuit product.