The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 06, 2019

Filed:

Mar. 10, 2015
Applicants:

Osram Gmbh, Munich, DE;

Osram Opto Semiconductors Gmbh, Regensburg, DE;

Inventors:

Maria Anc, Groveland, MA (US);

Alan Lenef, Belmont, MA (US);

Assignees:

OSRAM GmbH, München, DE;

OSRAM Opto Semiconductors GmbH, Regensburg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/50 (2010.01); B32B 3/02 (2006.01); B32B 3/10 (2006.01); B32B 3/24 (2006.01); B32B 7/027 (2019.01); B32B 7/04 (2019.01); C04B 35/115 (2006.01); F21K 9/64 (2016.01); H01L 33/64 (2010.01); F21Y 115/30 (2016.01); F21V 29/83 (2015.01); B32B 15/04 (2006.01); B32B 18/00 (2006.01); B32B 3/26 (2006.01); B32B 7/12 (2006.01); B32B 15/20 (2006.01);
U.S. Cl.
CPC ...
H01L 33/642 (2013.01); B32B 3/02 (2013.01); B32B 3/10 (2013.01); B32B 7/027 (2019.01); B32B 7/04 (2013.01); F21K 9/64 (2016.08); H01L 33/502 (2013.01); H01L 33/505 (2013.01); H01L 33/507 (2013.01); H01L 33/508 (2013.01); H01L 33/644 (2013.01); B32B 3/266 (2013.01); B32B 7/12 (2013.01); B32B 15/04 (2013.01); B32B 15/043 (2013.01); B32B 15/20 (2013.01); B32B 18/00 (2013.01); B32B 2250/44 (2013.01); B32B 2255/20 (2013.01); B32B 2255/205 (2013.01); B32B 2255/28 (2013.01); B32B 2307/302 (2013.01); B32B 2307/412 (2013.01); B32B 2307/416 (2013.01); B32B 2307/422 (2013.01); B32B 2311/08 (2013.01); B32B 2315/02 (2013.01); F21V 29/83 (2015.01); F21Y 2115/30 (2016.08); H01L 33/501 (2013.01); Y10T 428/24777 (2015.01);
Abstract

The present disclosure is directed to light converter assemblies with enhanced heat dissipation. A light converter assembly may comprise a confinement material applied to at least a first substrate and a phosphor material also deposited on the first substrate so as to be surrounded by the confinement material. The first substrate may be hermetically sealed to a second substrate using the confinement material so that the phosphor material is confined between the substrates and protected from atmospheric contamination. The substrates may comprise, for example, sapphire to allow for light beam transmission and heat conductance. Confinement materials that may be employed to seal the first substrate to the second substrate may include, for example, silicon or a metal (e.g., silver, copper, aluminum, etc.) The phosphor material may comprise, for example, at least one quantum dot material.


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