The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 06, 2019

Filed:

May. 27, 2016
Applicant:

Lg Innotek Co., Ltd., Seoul, KR;

Inventors:

Jung Hun Jang, Seoul, KR;

Seung Keun Nam, Seoul, KR;

Jeong Soon Yim, Seoul, KR;

Won Hee Choi, Seoul, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/20 (2010.01); H01L 33/22 (2010.01); H01L 33/12 (2010.01); H01L 33/00 (2010.01); H01L 33/06 (2010.01); H01L 33/42 (2010.01); H01L 33/58 (2010.01);
U.S. Cl.
CPC ...
H01L 33/12 (2013.01); H01L 33/007 (2013.01); H01L 33/06 (2013.01); H01L 33/20 (2013.01); H01L 33/22 (2013.01); H01L 33/42 (2013.01); H01L 33/58 (2013.01);
Abstract

A light emitting device, according to one embodiment, may comprise: a substrate having a pattern part disposed on the upper surface thereof; a first buffer layer disposed on the substrate; a second buffer later disposed on the first buffer layer; a first conductive semiconductor layer disposed on the second buffer layer; an active layer disposed on the first conductive semiconductor layer; a second conductive semiconductor layer disposed on the active layer; and a void layer disposed on the first buffer layer corresponding to the pattern part of the substrate. By further forming a void on the buffer layer, the embodiment has the effect of more effectively preventing defects caused by a potential difference.


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