The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 06, 2019

Filed:

Jul. 10, 2018
Applicant:

John Wood, Northamptonshire, GB;

Inventor:

John Wood, Northamptonshire, GB;

Assignee:

Other;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 29/732 (2006.01); H01L 29/808 (2006.01); H01L 29/10 (2006.01); H01L 29/06 (2006.01); H03K 7/08 (2006.01); H01L 29/08 (2006.01); H02M 3/335 (2006.01); H01L 21/306 (2006.01); H03K 17/60 (2006.01); H01L 29/16 (2006.01); H01L 29/78 (2006.01); H02M 1/00 (2006.01); H01L 29/739 (2006.01); H01L 29/66 (2006.01); H01L 27/102 (2006.01); H01L 27/098 (2006.01); H01L 29/417 (2006.01);
U.S. Cl.
CPC ...
H01L 29/7322 (2013.01); H01L 21/30604 (2013.01); H01L 29/0696 (2013.01); H01L 29/0804 (2013.01); H01L 29/0821 (2013.01); H01L 29/1004 (2013.01); H01L 29/1095 (2013.01); H01L 29/1608 (2013.01); H01L 29/8083 (2013.01); H02M 3/33584 (2013.01); H03K 7/08 (2013.01); H03K 17/60 (2013.01); H01L 27/098 (2013.01); H01L 27/102 (2013.01); H01L 27/1022 (2013.01); H01L 29/1058 (2013.01); H01L 29/41708 (2013.01); H01L 29/66901 (2013.01); H01L 29/66916 (2013.01); H01L 29/7395 (2013.01); H01L 29/7802 (2013.01); H02M 2001/0009 (2013.01);
Abstract

Double sided versions of several power transistor types are devices that are already known in the literature. Devices built in this configuration are generally required to have a separate driver circuit to control the front and rear control electrodes and provide the gate or base voltage and/or currents for the power switch. This is because there may be of the order of 1000V potential-difference between the frontside and rearside potentials when the transistor is in the off condition—and a single integrated circuit cannot generally sustain this within a single package. The NPN configuration is preferred in this case to benefit from electron conduction for the main power path between the emitters. However, problems arising when using a P-type wafer. The present invention seeks to avoid the use of P-type wafers while still getting the higher conduction performance of NPN operation.


Find Patent Forward Citations

Loading…