The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 06, 2019

Filed:

Jan. 02, 2017
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Carl J Radens, LaGrangeville, NY (US);

Richard Q Williams, Essex Junction, VT (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/41 (2006.01); H01L 29/417 (2006.01); H01L 29/06 (2006.01); H01L 29/78 (2006.01); H01L 23/535 (2006.01); H01L 21/027 (2006.01); H01L 21/306 (2006.01); H01L 21/683 (2006.01); H01L 21/768 (2006.01); H01L 23/528 (2006.01); H01L 23/532 (2006.01); H01L 29/45 (2006.01); H01L 23/522 (2006.01); H01L 29/423 (2006.01); H01L 29/786 (2006.01);
U.S. Cl.
CPC ...
H01L 29/41766 (2013.01); H01L 21/0273 (2013.01); H01L 21/30604 (2013.01); H01L 21/30625 (2013.01); H01L 21/6835 (2013.01); H01L 21/76831 (2013.01); H01L 21/76877 (2013.01); H01L 21/76895 (2013.01); H01L 23/528 (2013.01); H01L 23/5226 (2013.01); H01L 23/535 (2013.01); H01L 23/53214 (2013.01); H01L 23/53228 (2013.01); H01L 23/53233 (2013.01); H01L 23/53257 (2013.01); H01L 29/0649 (2013.01); H01L 29/0673 (2013.01); H01L 29/41733 (2013.01); H01L 29/41775 (2013.01); H01L 29/41791 (2013.01); H01L 29/42392 (2013.01); H01L 29/45 (2013.01); H01L 29/458 (2013.01); H01L 29/785 (2013.01); H01L 29/78654 (2013.01); H01L 29/78696 (2013.01); H01L 2221/6834 (2013.01); H01L 2221/68318 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/68359 (2013.01);
Abstract

A structure of a semiconductor device is described. In one aspect of the invention, a FinFET semiconductor device includes a FinFET transistor which includes a source region and a drain region disposed in a fin on a first surface of a substrate. A gate structure is disposed over a central portion of the fin. A wiring layer of conductive material is disposed over a second surface of the substrate which is opposite to the first surface of the substrate. A set of contact studs include a first contact stud which extends completely through the height of the fin in the source region and the substrate to the wiring layer. The set of contact studs also includes a second contact stud which extends completely through the height of the fin in the drain region and the substrate to the wiring layer. In other aspects of the invention, the device is a Nanosheet device or an inverter.


Find Patent Forward Citations

Radens, Carl. (2019). Structure for reduced source and drain contact to gate stack capacitance (U.S. Patent No. 10374046). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10374046

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…