The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 06, 2019

Filed:

Aug. 08, 2017
Applicant:

Apple Inc., Cupertino, CA (US);

Inventors:

Ya Wen Hsu, San Francisco, CA (US);

Douglas S. Brodie, Los Gatos, CA (US);

Steven Webster, Palo Alto, CA (US);

Assignee:

Apple Inc., Cupertino, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/00 (2006.01); H04N 5/00 (2011.01); H01L 27/146 (2006.01); H04N 5/225 (2006.01); G02B 7/02 (2006.01); H01L 31/0232 (2014.01);
U.S. Cl.
CPC ...
H01L 27/14618 (2013.01); G02B 7/02 (2013.01); H01L 27/14625 (2013.01); H01L 27/14685 (2013.01); H01L 31/02327 (2013.01); H04N 5/2253 (2013.01);
Abstract

Compact camera modules that may be used in small form factor devices. The camera module may include a lens holder configured to receive one or more lens elements and a photosensor. In some embodiments, the lens holder may define a first recess for receiving the lens elements and a second recess for receiving one or more other components, such as the photosensor. In some embodiments, the photosensor may be configured to communicate with a flex circuit board without coupling the photosensor to a substrate to form a flip chip that communicates with the flex circuit board. The photosensor may be optically aligned with the lens elements and bonded to the lens holder such that the photosensor is fixed in an aligned position and at least partially enclosed by the lens holder.


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