The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 06, 2019
Filed:
Jun. 12, 2017
Applicant:
Newsouth Innovations Pty Limited, Sydney NSW, AU;
Inventors:
Joris Gerhard Keizer, Seaforth, AU;
Matthias Koch, Berlin, DE;
Michelle Yvonne Simmons, Woollahra, AU;
Assignee:
NewSouth Innovations Pty Limited, Sydney, NSW, AU;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/66 (2006.01); H01L 23/544 (2006.01); H01L 27/18 (2006.01); H01L 39/22 (2006.01); H01L 39/24 (2006.01); G06T 7/00 (2017.01); G06N 10/00 (2019.01);
U.S. Cl.
CPC ...
H01L 23/544 (2013.01); G06N 10/00 (2019.01); G06T 7/0008 (2013.01); H01L 27/18 (2013.01); H01L 39/223 (2013.01); H01L 39/2493 (2013.01); G06T 2207/30148 (2013.01); H01L 2223/54426 (2013.01);
Abstract
The present disclosure provides methods for fabricating multi-layered electronic architectures in silicon and/or germanium. In particular the disclosure provides an advanced marker design and a methodology for aligning devices on multiple layers of a multi-layered electronic architecture. The disclosure also provides a process for growing a semiconductor material with high quality surfaces.