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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10373889 B1

PDFFull Text
Date of Patent:
Aug. 06, 2019

Filed:

Mar. 24, 2017

Electronic device and method of manufacturing the same

Applicant:

Denso Corporation, Kariya, Aichi-pref., JP;

Inventors:

Masanori Ooshima, Kariya, JP;

Eiji Hayashi, Kariya, JP;

Assignee:

DENSO CORPORATION, Kariya, JP;

Attorney:

Posz Law Group, PLC

Primary Examiner:

Daniel P Shook

Int. Cl.
CPC ...
H01L 21/56 (2006.01); H01L 25/065 (2006.01); G01N 29/04 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01); H01L 23/28 (2006.01); H01L 23/29 (2006.01); H01L 23/31 (2006.01); H01L 23/48 (2006.01); H01L 23/50 (2006.01); H01L 25/07 (2006.01); H01L 25/18 (2006.01); H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3142 (2013.01); G01N 29/04 (2013.01); H01L 21/4803 (2013.01); H01L 21/4825 (2013.01); H01L 21/56 (2013.01); H01L 23/28 (2013.01); H01L 23/29 (2013.01); H01L 23/48 (2013.01); H01L 23/49537 (2013.01); H01L 23/49562 (2013.01); H01L 23/49568 (2013.01); H01L 23/49575 (2013.01); H01L 23/49582 (2013.01); H01L 23/49586 (2013.01); H01L 23/50 (2013.01); H01L 24/32 (2013.01); H01L 24/33 (2013.01); H01L 25/0655 (2013.01); H01L 25/07 (2013.01); H01L 25/18 (2013.01); G01N 2291/267 (2013.01); H01L 23/49551 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/33 (2013.01); H01L 2224/33181 (2013.01); H01L 2224/48247 (2013.01); H01L 2924/14252 (2013.01); H01L 2924/181 (2013.01);
Abstract

In an electronic device including an electronic component, a sealing resin body, a first member having at least a portion located in the sealing resin body, and a second member connected to the first member via a solder in the sealing resin body, the first member includes a base material formed of a metal material and a coated film at least on a surface of the base material which is adjacent to a back surface of the first member opposite to a facing surface of the first member facing the second member. The coated film includes a metal thin film on a surface of the base material and an uneven oxide film on the metal thin film and made of an oxide of a same metal as a main component of the metal thin film.

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