The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 06, 2019
Filed:
Mar. 24, 2017
Applicant:
Fujifilm Corporation, Tokyo, JP;
Inventors:
Yuichiro Goto, Haibara-gun, JP;
Tadashi Oomatsu, Haibara-gun, JP;
Assignee:
FUJIFILM Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/52 (2006.01); H01L 21/768 (2006.01); H01L 21/027 (2006.01); H01L 21/3205 (2006.01); H01L 23/532 (2006.01); B29C 44/02 (2006.01); B29C 44/12 (2006.01); H01L 21/02 (2006.01); H01L 23/522 (2006.01); H01L 23/528 (2006.01); B29C 37/00 (2006.01); B29K 33/00 (2006.01); B29K 105/00 (2006.01); B29L 31/34 (2006.01); B29K 105/04 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76817 (2013.01); B29C 37/0053 (2013.01); B29C 44/02 (2013.01); B29C 44/12 (2013.01); H01L 21/027 (2013.01); H01L 21/02118 (2013.01); H01L 21/02203 (2013.01); H01L 21/3205 (2013.01); H01L 21/768 (2013.01); H01L 21/76807 (2013.01); H01L 21/76877 (2013.01); H01L 23/5226 (2013.01); H01L 23/5283 (2013.01); H01L 23/532 (2013.01); H01L 23/5329 (2013.01); H01L 23/53228 (2013.01); B29C 44/1219 (2013.01); B29K 2033/12 (2013.01); B29K 2105/0002 (2013.01); B29K 2105/0094 (2013.01); B29K 2105/041 (2013.01); B29K 2105/045 (2013.01); B29K 2909/02 (2013.01); B29K 2995/0006 (2013.01); B29L 2031/3406 (2013.01); H01L 2924/0002 (2013.01);
Abstract
Provided are a method of manufacturing a porous body capable of easily manufacturing a porous body, a porous body, a method of manufacturing a device, a device, a method of manufacturing a wiring structure, and a wiring structure. A photocurable composition including a condensing gas and a polymerizable compound is applied to a substrate or a mold, the photocurable composition is sandwiched between the substrate and the mold and then the photocurable composition is irradiated with light to cure the photocurable composition, and the mold is released from a surface of the cured photocurable composition.