The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10373848 B1

Expired

Date of Patent:

Aug. 06, 2019

Filed:

Apr. 30, 2018

Method of preparing the led display device

Applicant:

Shenzhen Hoxled Optoelectronic Technology Co., Ltd., Shenzhen, CN;

Inventors:

Jun Deng, Shenzhen, CN;

Youfa Zhou, Shenzhen, CN;

Assignee:

SHENZHEN HOXLED OPTOELECTRONIC TECHNOLOGY CO., LTD., Shenzhen, CN;

Attorney:

Shimokaji IP

Primary Examiner:

Hoai V Pham

Int. Cl.

CPC ...

H01L 21/67 (2006.01); H01L 25/075 (2006.01); H01L 33/52 (2010.01); B29C 45/14 (2006.01); B29C 45/57 (2006.01); H01L 33/54 (2010.01); H01L 33/56 (2010.01); B29K 63/00 (2006.01); B29L 31/34 (2006.01);

U.S. Cl.

CPC ...

H01L 21/67126 (2013.01); B29C 45/14065 (2013.01); B29C 45/14639 (2013.01); B29C 45/57 (2013.01); H01L 25/0753 (2013.01); H01L 33/52 (2013.01); H01L 33/54 (2013.01); H01L 33/56 (2013.01); B29K 2063/00 (2013.01); B29L 2031/3475 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0091 (2013.01);

Abstract

An LED display device includes a substrate and an LED encapsulation unit disposed on a side of the substrate, the LED encapsulation unit includes an LED stent and an LED chip encapsulated in the LED stent, a epoxy resin encapsulates the side of the substrate on which the LED encapsulation unit is disposed and the LED encapsulation unit to form a protection layer shielding the LED encapsulation unit. The epoxy resin completely encapsulates the substrate and the LED encapsulation unit to protect effectively the substrate and the LED encapsulation unit, which is sufficient to resist severe environment. Compared with the prior art, the service life of the LED display device is effectively prolonged, cost is reduced. The invention also provides a molding module for preparing the LED display device, and a preparation method thereof.

Find Patent Forward Citations

Deng, Jun. (2019). Method of preparing the led display device (U.S. Patent No. 10373848). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10373848

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