The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 06, 2019

Filed:

Aug. 07, 2018
Applicant:

Panduit Corp., Tinley Park, IL (US);

Inventors:

Royal O. Jenner, Frankfort, IL (US);

Masud Bolouri-Saransar, Orland Park, IL (US);

Ronald A. Nordin, Naperville, IL (US);

Paul W. Wachtel, Arlington Heights, IL (US);

Stephen A. Thwaites, Walton, KY (US);

Roy B. Kusuma, Cincinnati, OH (US);

James D. Malkemus, Union, KY (US);

Scott M. Brown, Independence, KY (US);

Assignee:

Panduit Corp., Tinley Park, IL (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01B 11/08 (2006.01); H01B 11/00 (2006.01); H01B 13/22 (2006.01);
U.S. Cl.
CPC ...
H01B 11/085 (2013.01); H01B 11/002 (2013.01); H01B 13/22 (2013.01);
Abstract

A communications cable having a plurality of twisted pairs of conductors and various embodiments of a metal foil tapes between the twisted pairs and a cable jacket is disclosed. In some embodiments, a metal foil tape includes a discontinuous metal layer and a polymer layer bonded to the metal layer. Portions of the metal layer and the polymer layer are deformed to form a plurality of dimples, the dimples forming air gaps between the polymer layer and the cable core or a barrier layer if used. The air gaps lower the overall dielectric constant between the metal layer and the cable core, thereby lowering the alien capacitance of the communications cable.


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