The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 06, 2019

Filed:

Jan. 13, 2017
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;

Inventor:

Tea-Geon Kim, Asan-si, KR;

Assignee:

Samsung Electronics Co., Ltd., Suwon-Si, Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06K 9/46 (2006.01); G06T 7/00 (2017.01); G06T 7/70 (2017.01); G06K 9/32 (2006.01); G06T 7/73 (2017.01);
U.S. Cl.
CPC ...
G06T 7/70 (2017.01); G06K 9/3216 (2013.01); G06K 9/4604 (2013.01); G06T 7/0004 (2013.01); G06T 7/0006 (2013.01); G06T 7/73 (2017.01); G06K 2009/3225 (2013.01); G06K 2209/19 (2013.01); G06T 2207/10016 (2013.01); G06T 2207/30148 (2013.01);
Abstract

A method for predicting the location of mark is performed for a substrate which includes a plurality of electronic device regions each electronic region includes a mark and a reference indication on a first surface and a sawing indication on a second surface opposite to the first surface. The method includes obtaining first and second image information for the first and second surfaces, extracting a sawing line based on the sawing indication in the second image information, calculating a first spaced distance between the sawing line and the reference indication in the first information, calculating a second spaced distance between the sawing line and the reference indication, and predicting the location of the mark based on whether the first and second spaced distances correspond to a predetermined reference distance. The mark is on each of the electronic device regions separated from each other along the sawing line.


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