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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10373043 B1

PDFFull Text
Date of Patent:
Aug. 06, 2019

Filed:

Aug. 24, 2016

Radio ic device

Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo-shi, Kyoto-fu, JP;

Inventors:

Noboru Kato, Nagaokakyo, JP;

Satoshi Ishino, Nagaokakyo, JP;

Takeshi Kataya, Nagaokakyo, JP;

Ikuhei Kimura, Nagaokakyo, JP;

Nobuo Ikemoto, Nagaokakyo, JP;

Yuya Dokai, Nagaokakyo, JP;

Assignee:

MURATA MANUFACTURING CO., LTD., Kyoto, JP;

Attorney:

Keating & Bennett, LLP

Primary Examiner:

Dameon E Levi

Assistant Examiner:

Jennifer F Hu

Int. Cl.
CPC ...
G06K 19/077 (2006.01); H01Q 1/36 (2006.01); H01Q 1/38 (2006.01); H01Q 1/42 (2006.01); H01Q 1/44 (2006.01); H01Q 7/00 (2006.01); H01Q 9/16 (2006.01); H01Q 9/30 (2006.01); H01Q 13/10 (2006.01); H05K 1/14 (2006.01); G06K 19/06 (2006.01); G06K 19/07 (2006.01); H01L 23/498 (2006.01); H01L 23/552 (2006.01); H01L 23/66 (2006.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01); H05K 1/16 (2006.01);
U.S. Cl.
CPC ...
G06K 19/07749 (2013.01); G06K 19/06187 (2013.01); G06K 19/0723 (2013.01); G06K 19/07756 (2013.01); G06K 19/07773 (2013.01); G06K 19/07779 (2013.01); G06K 19/07783 (2013.01); G06K 19/07784 (2013.01); G06K 19/07786 (2013.01); H01L 23/49838 (2013.01); H01L 23/552 (2013.01); H01L 23/66 (2013.01); H01Q 1/36 (2013.01); H01Q 1/38 (2013.01); H01Q 1/42 (2013.01); H01Q 1/44 (2013.01); H01Q 7/00 (2013.01); H01Q 9/16 (2013.01); H01Q 9/30 (2013.01); H01Q 13/10 (2013.01); H05K 1/0216 (2013.01); H05K 1/141 (2013.01); H05K 1/181 (2013.01); H01L 2223/6655 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73204 (2013.01); H01L 2924/3011 (2013.01); H01L 2924/3025 (2013.01); H01L 2924/30107 (2013.01); H05K 1/0237 (2013.01); H05K 1/0239 (2013.01); H05K 1/16 (2013.01); H05K 2201/1003 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10022 (2013.01); H05K 2201/10098 (2013.01); H05K 2201/10371 (2013.01); H05K 2201/10522 (2013.01);
Abstract

A radio IC device includes an electromagnetic coupling module includes a radio IC chip arranged to process transmitted and received signals and a feed circuit board including an inductance element. The feed circuit board includes an external electrode electromagnetically coupled to the feed circuit, and the external electrode is electrically connected to a shielding case or a wiring cable. The shielding case or the wiring cable functions as a radiation plate. The radio IC chip is operated by a signal received by the shielding case or the wiring, and the answer signal from the radio IC chip is radiated from the shielding case or the wiring cable to the outside. A metal component functions as the radiation plate, and the metal component may be a ground electrode disposed on the printed wiring board.

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