The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 06, 2019

Filed:

Jan. 25, 2017
Applicant:

Renesas Electronics Corporation, Tokyo, JP;

Inventor:

Koichi Ishimi, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 1/08 (2006.01); G06F 9/38 (2018.01); G11C 7/10 (2006.01); G06F 13/40 (2006.01); G06F 13/42 (2006.01); G06F 15/80 (2006.01); G06F 1/3293 (2019.01);
U.S. Cl.
CPC ...
G06F 13/4031 (2013.01); G06F 1/08 (2013.01); G06F 1/3293 (2013.01); G06F 9/3887 (2013.01); G06F 13/4022 (2013.01); G06F 13/4282 (2013.01); G06F 15/8007 (2013.01); G11C 7/1072 (2013.01); Y02D 10/122 (2018.01); Y02D 10/151 (2018.01);
Abstract

The present invention intends to provide a high-performance multi-processor device in which independent buses and external bus interfaces are provided for each group of processors of different architectures, if a single chip includes a plurality of multi-processor groups. A multi-processor device of the present invention comprises a plurality of processors including first and second groups of processors of different architectures such as CPUs, SIMD type super-parallel processors, and DSPs, a first bus which is a CPU bus to which the first processor group is coupled, a second bus which is an internal peripheral bus to which the second processor group is coupled, independent of the first bus, a first external bus interface to which the first bus is coupled, and a second external bus interface to which the second bus is coupled, over a single semiconductor chip.


Find Patent Forward Citations

Ishimi, Koichi. (2019). Multi-processor device (U.S. Patent No. 10372654). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10372654

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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