The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 06, 2019

Filed:

Jul. 15, 2016
Applicant:

Apple Inc., Cupertino, CA (US);

Inventors:

Brian M. Gable, Cupertino, CA (US);

Carlo Di Nallo, Cupertino, CA (US);

Colin M. Ely, Cupertino, CA (US);

Craig A. Horton, Cupertino, CA (US);

Erik G. de Jong, Cupertino, CA (US);

Fletcher R. Rothkopf, Cupertino, CA (US);

Henry B. Wettersten, Cupertino, CA (US);

Hoishun Li, Cupertino, CA (US);

Jason C. Sauers, Cupertino, CA (US);

Jayesh Nath, Cupertino, CA (US);

Mario Martinis, Cupertino, CA (US);

Mattia Pascolini, Cupertino, CA (US);

Michael P. Coleman, Cupertino, CA (US);

Rex T. Ehman, Cupertino, CA (US);

Zheyu Wang, Cupertino, CA (US);

Assignee:

APPLE INC., Cupertino, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06F 1/16 (2006.01); H01Q 1/22 (2006.01); H04B 1/3888 (2015.01); H04M 1/02 (2006.01); H05K 5/00 (2006.01); H05K 5/04 (2006.01); B29C 70/76 (2006.01); H01Q 1/24 (2006.01); H01Q 21/28 (2006.01); H04M 1/18 (2006.01); B29L 31/34 (2006.01);
U.S. Cl.
CPC ...
G06F 1/1656 (2013.01); B29C 70/763 (2013.01); H01Q 1/22 (2013.01); H01Q 1/243 (2013.01); H01Q 21/28 (2013.01); H04B 1/3888 (2013.01); H04M 1/0202 (2013.01); H04M 1/0249 (2013.01); H04M 1/18 (2013.01); H05K 5/0013 (2013.01); H05K 5/04 (2013.01); B29L 2031/3481 (2013.01); G06F 1/163 (2013.01); G06F 1/1637 (2013.01);
Abstract

A housing for an electronic device is disclosed. The housing includes a first conductive component defining a first interface surface, a second conductive component defining a second interface surface facing the first interface surface, and a joint structure between the first and second interface surfaces. The joint structure includes a molded element forming a portion of an exterior surface of the housing, and a sealing member forming a watertight seal between the first and second conductive components. Methods of forming the electronic device housing are also disclosed.


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