The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 06, 2019
Filed:
Sep. 09, 2016
Applicant:
Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;
Inventors:
Keiko Kashihara, Osaka, JP;
Hiroharu Inoue, Osaka, JP;
Shingo Yoshioka, Osaka, JP;
Takashi Hoshi, Fukushima, JP;
Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 5/28 (2006.01); C08J 5/24 (2006.01); G01N 3/18 (2006.01); H05K 1/02 (2006.01); H05K 1/03 (2006.01); H05K 3/06 (2006.01); B32B 15/08 (2006.01); B32B 37/10 (2006.01); B32B 38/00 (2006.01);
U.S. Cl.
CPC ...
G01N 3/18 (2013.01); B32B 5/28 (2013.01); B32B 15/08 (2013.01); B32B 37/1018 (2013.01); C08J 5/24 (2013.01); H05K 1/0271 (2013.01); H05K 1/0373 (2013.01); H05K 3/06 (2013.01); B32B 37/10 (2013.01); B32B 2038/0076 (2013.01); B32B 2309/02 (2013.01); B32B 2309/105 (2013.01); B32B 2457/08 (2013.01); C08J 2363/00 (2013.01); G01N 2203/0017 (2013.01); G01N 2203/0057 (2013.01); H05K 1/038 (2013.01); H05K 2201/0209 (2013.01); H05K 2201/068 (2013.01);
Abstract
A prepreg includes a resin layer constituted by a half-cured product of a thermosetting resin composition, and a fibrous substrate provided in the resin layer. A prepreg test piece that is a cured product obtained by heat curing the thermosetting resin composition has a maximum value of 400 kPa or less for thermal shrinkage stress measured by a predetermined thermal stress test.