The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 06, 2019

Filed:

Oct. 11, 2016
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Timothy Joseph Chainer, Putnam Valley, NY (US);

Pritish Ranjan Parida, Fishkill, NY (US);

Fanghao Yang, Somerset, NJ (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F28D 1/03 (2006.01); F28F 3/08 (2006.01); F28F 3/12 (2006.01); H05K 7/20 (2006.01); F28D 15/00 (2006.01); F28D 15/02 (2006.01); F28D 21/00 (2006.01); H01L 23/373 (2006.01); H01L 23/427 (2006.01);
U.S. Cl.
CPC ...
F28F 3/086 (2013.01); F28D 15/00 (2013.01); F28D 15/025 (2013.01); F28D 15/0233 (2013.01); F28D 15/0258 (2013.01); F28D 15/0266 (2013.01); F28F 3/12 (2013.01); H01L 23/427 (2013.01); H05K 7/20309 (2013.01); F28D 1/0341 (2013.01); F28D 2021/0028 (2013.01); H01L 23/3736 (2013.01); H01L 23/3737 (2013.01);
Abstract

Devices that have integrated cooling structures for counterflow, two-phase cooling and systems thereof are provided. In one example, a first structure can comprise a first cooling channel. The first cooling channel can have a first value of width that increases as the first cooling channel extends from a first side of a heat transfer area towards a second side of the heat transfer area. Also, a second structure can comprise a second cooing channel. The second cooling channel can have a second value of width that increases as the second cooling channel extends from the second side of the heat transfer area towards the first side of the heat transfer area.


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