The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 06, 2019

Filed:

May. 25, 2015
Applicant:

Shin-etsu Chemical Co., Ltd., Tokyo, JP;

Inventors:

Yasuhisa Ishihara, Annaka, JP;

Akihiro Endo, Annaka, JP;

Takahiro Maruyama, Annaka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09K 5/14 (2006.01); C08K 7/18 (2006.01); C08L 83/04 (2006.01); H01L 23/36 (2006.01); H01L 23/373 (2006.01); H05K 7/20 (2006.01); C09D 183/04 (2006.01); C08K 3/22 (2006.01);
U.S. Cl.
CPC ...
C09K 5/14 (2013.01); C08K 7/18 (2013.01); C08L 83/04 (2013.01); C09D 183/04 (2013.01); H01L 23/36 (2013.01); H01L 23/373 (2013.01); H01L 23/3735 (2013.01); H01L 23/3737 (2013.01); H05K 7/20 (2013.01); C08K 3/22 (2013.01); C08K 2003/2227 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A thermally conductive sheet including a glass cloth filled with a thermally conductive resin composition, one or both surfaces of the glass cloth being layered with a cured, thermally conductive silicone composition, wherein the thermally conductive silicone composition comprises a silicone component and thermally conductive filler (C) of an amount of 1,200 to 2,000 parts by mass, relative to 100 parts by mass of the silicone component, the thermally conductive filler (C) has an average particle size smaller than 15 μm, and an amount of particles having a particle size of 45 μm or larger is 0 to 3 mass % and an amount of particles having a particle size of 75 μm or larger is 0 to 0.01 mass %, based on an amount of the thermally conductive filler (C).


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