The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 06, 2019

Filed:

Apr. 09, 2013
Applicant:

Chemetall Gmbh, Frankfurt am Main, DE;

Inventors:

Miroslav Kralev, Frankfurt am Main, DE;

Björn Sievers, Frankfurt am Main, DE;

Peter Bons, Reichelsheim, DE;

Francisco Diez, Mörfelden-Walldorf, DE;

Assignee:

Chemetall GmbH, Frankfurt am Main, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09D 181/04 (2006.01); B05D 7/24 (2006.01); C08L 81/00 (2006.01); B05D 3/06 (2006.01); C09D 181/00 (2006.01); C08L 81/04 (2006.01);
U.S. Cl.
CPC ...
C09D 181/04 (2013.01); B05D 3/06 (2013.01); B05D 7/24 (2013.01); C08L 81/00 (2013.01); C08L 81/04 (2013.01); C09D 181/00 (2013.01);
Abstract

A method for curing a mixture of a matrix and a curing agent based on sulfur-containing polymers on command and so rapidly that a tack-free surface results. A method for coating a substrate with the composition and of curing a sealant is also provided. The matrix and curing agent containing sulfur-containing polymers. The mixture is an uncured mixture with an isocyanate content, and the matrix is uncured and contains a mercaptan-terminated base polymer based on at least one polyether, polythioether, polysulfide or copolymers thereof. The uncured matrix, the curing agent, or both contain at least one photoinitiator based on sterically-inhibited tertiary amines. The mixture cures in the temperature range of −10 to +70° C. after the high-energy actinic radiation is applied. Corresponding matrices A, mixtures B, curing agents, sealant systems, and substrates, e.g., aircraft are contemplated.


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