The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 06, 2019

Filed:

Feb. 19, 2015
Applicant:

Mitsubishi Gas Chemical Company, Inc., Tokyo, JP;

Inventors:

Yoshitaka Ueno, Tokyo, JP;

Masataka Kudo, Tokyo, JP;

Michio Yaginuma, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 15/08 (2006.01); B32B 15/082 (2006.01); B32B 15/092 (2006.01); B32B 27/18 (2006.01); B32B 27/28 (2006.01); B32B 27/30 (2006.01); B32B 27/38 (2006.01); H05K 1/03 (2006.01); C08J 5/24 (2006.01); C08L 63/00 (2006.01); C08L 63/02 (2006.01); C08L 63/04 (2006.01); C08L 71/12 (2006.01); C08K 5/5399 (2006.01); B32B 27/20 (2006.01); B32B 5/02 (2006.01); B32B 27/06 (2006.01); C08K 3/36 (2006.01); C08K 7/18 (2006.01); C08L 79/04 (2006.01); C08G 73/06 (2006.01);
U.S. Cl.
CPC ...
C08L 71/126 (2013.01); B32B 5/02 (2013.01); B32B 15/08 (2013.01); B32B 27/06 (2013.01); B32B 27/20 (2013.01); C08J 5/24 (2013.01); C08K 3/36 (2013.01); C08K 5/5399 (2013.01); C08K 7/18 (2013.01); C08L 63/00 (2013.01); C08L 71/12 (2013.01); H05K 1/0346 (2013.01); H05K 1/0373 (2013.01); B32B 2262/101 (2013.01); B32B 2307/202 (2013.01); B32B 2307/3065 (2013.01); B32B 2457/00 (2013.01); B32B 2457/08 (2013.01); C08G 73/0655 (2013.01); C08J 2371/12 (2013.01); C08L 79/04 (2013.01); C08L 2203/20 (2013.01); H05K 2201/0145 (2013.01); H05K 2201/0209 (2013.01);
Abstract

A resin composition comprising a polyphenylene ether (A) having a number average molecular weight of 500 to 5000; a cyclophosphazene compound (B); a non-halogen-based epoxy resin (C); a cyanate compound (D); and a filler (E).


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