The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 06, 2019

Filed:

Feb. 26, 2016
Applicants:

Andrew J. Boydston, Seattle, WA (US);

Adam Edward Goetz, Seattle, WA (US);

Chang-uk Lee, Seattle, WA (US);

Gregory Isaac Peterson, Tacoma, WA (US);

Mark A. Ganter, Edmonds, WA (US);

Duane W. Storti, Seattle, WA (US);

Mete Yurtoglu, Seattle, WA (US);

Inventors:

Andrew J. Boydston, Seattle, WA (US);

Adam Edward Goetz, Seattle, WA (US);

Chang-Uk Lee, Seattle, WA (US);

Gregory Isaac Peterson, Tacoma, WA (US);

Mark A. Ganter, Edmonds, WA (US);

Duane W. Storti, Seattle, WA (US);

Mete Yurtoglu, Seattle, WA (US);

Assignees:

Ricoh Company, Ltd., Tokyo, JP;

University of Washington, Seattle, WA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 67/00 (2017.01); C08L 61/16 (2006.01); B29C 64/165 (2017.01); C08L 71/00 (2006.01); B33Y 10/00 (2015.01); B33Y 70/00 (2015.01); B29C 35/08 (2006.01); B29K 71/00 (2006.01); B29K 79/00 (2006.01);
U.S. Cl.
CPC ...
C08L 61/16 (2013.01); B29C 64/165 (2017.08); C08L 71/00 (2013.01); B29C 35/0805 (2013.01); B29C 2035/0827 (2013.01); B29K 2071/00 (2013.01); B29K 2079/08 (2013.01); B29K 2995/0077 (2013.01); B33Y 10/00 (2014.12); B33Y 70/00 (2014.12); C08G 2650/40 (2013.01);
Abstract

The present invention provides high performance polymer (HPP) compositions, methods, processes, and systems for the manufacture of three-dimensional articles made of polymers using molding or 3D printing. The HPP compositions comprise a first HPP dissolved in a solvent and a second HPP present as a solid.


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