The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 06, 2019
Filed:
Jan. 17, 2008
Keita Itakura, Ichihara, JP;
Toshiyuki Ishii, Chiba, JP;
Rikuo Onishi, Ichihara, JP;
Satoshi Hashizume, Takaishi, JP;
Keita Itakura, Ichihara, JP;
Toshiyuki Ishii, Chiba, JP;
Rikuo Onishi, Ichihara, JP;
Satoshi Hashizume, Takaishi, JP;
PRIME POLYMER CO., LTD., Tokyo, JP;
MITSUI CHEMICALS, INC., Tokyo, JP;
Abstract
Propylene polymers and propylene resin compositions containing the polymers are used as molded articles used under stress for a long period such as automotive parts, housing parts, home appliance parts and electric power tool parts. Stress-resistant molded articles of the invention are obtained from these materials. A propylene homopolymer (A) satisfies the following requirements (1) to (3), and a polypropylene resin composition contains the propylene homopolymer (A). (1) The ratio (Mw/Mn) of weight average molecular weight (Mw) to number average molecular weight (Mn) according to GPC is in the range of 1.2 to 3.5. (2) Mn is in the range of 35,000 to 400,000. (3) The content of components soluble in o-dichlorobenzene at 90° C. is not more than 4 wt %.