The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 06, 2019
Filed:
Dec. 28, 2015
Mitsubishi Aircraft Corporation, Aichi, JP;
Hiromichi Akiyama, Tokyo, JP;
Hideki Horizono, Tokyo, JP;
Kazuaki Kishimoto, Tokyo, JP;
Masahiro Shinya, Tokyo, JP;
Shinya Suzukake, Tokyo, JP;
MITSUBISHI AIRCRAFT CORPORATION, Aichi, JP;
Abstract
The present invention aims to sufficiently impregnate each layer of a fiber substrate group composed of fiber substrates, which are used for fiber-reinforced resin molding by a resin injection method, with a resin. To successively stack a plurality of fiber substrates, each of which has arrayed fiber bundles and is a material composing a fiber-reinforced resin along with a resin, with their fiber bundles oriented in the same direction, the plurality of fiber substrates are integrated in a state where border zones between the fiber bundles adjacent to each other in an array direction are aligned with one another among the fiber substrates.