The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 30, 2019
Filed:
Aug. 15, 2017
Applicant:
Guangdong Oppo Mobile Telecommunications Corp., Ltd., Dongguan, CN;
Inventor:
Wenzhen Zhang, Dongguan, CN;
Assignee:
Guangdong Oppo Mobile Telecommunications Corp., Ltd., Dongguan, CN;
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H05K 1/11 (2006.01); H05K 1/14 (2006.01); H04M 1/02 (2006.01); G06K 9/00 (2006.01); H05K 1/02 (2006.01); H05K 3/30 (2006.01); H05K 3/36 (2006.01); H05K 5/03 (2006.01); G06F 1/16 (2006.01);
U.S. Cl.
CPC ...
H05K 1/189 (2013.01); H04M 1/026 (2013.01); H05K 1/0281 (2013.01); H05K 1/111 (2013.01); H05K 1/144 (2013.01); H05K 3/301 (2013.01); H05K 3/305 (2013.01); H05K 3/363 (2013.01); H05K 5/03 (2013.01); G06F 1/1684 (2013.01); G06F 2203/0338 (2013.01); G06K 9/00006 (2013.01); H04M 2250/12 (2013.01); H05K 2201/041 (2013.01); H05K 2201/10151 (2013.01); H05K 2201/10318 (2013.01); H05K 2201/10325 (2013.01); H05K 2201/10757 (2013.01);
Abstract
A fingerprint module includes a cover plate, a fingerprint chip, an intermediate board, and a circuit board. An assembling region is disposed on the cover plate. The fingerprint chip is fixed in the assembling region. The intermediate board is bonded to one surface of the fingerprint chip opposite to the cover plate to press the fingerprint chip. The circuit board is electrically connected to the fingerprint chip via the intermediate board.