The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 30, 2019

Filed:

Oct. 23, 2017
Applicant:

Inter-university Research Institute Corporation National Institutes of Natual Sciences, Tokyo, JP;

Inventors:

Takunori Taira, Okazaki, JP;

Arvydas Kausas, Okazaki, JP;

Lihe Zheng, Okazaki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01S 3/042 (2006.01); H01S 3/17 (2006.01); H01S 5/02 (2006.01); B29C 65/16 (2006.01); B29C 65/00 (2006.01); H01S 3/04 (2006.01); H01S 3/16 (2006.01); H01S 5/024 (2006.01); G02F 1/35 (2006.01); H01S 3/06 (2006.01); H01S 3/113 (2006.01); H01S 3/108 (2006.01); H01S 3/07 (2006.01);
U.S. Cl.
CPC ...
H01S 3/042 (2013.01); B29C 65/16 (2013.01); B29C 66/00145 (2013.01); B29C 66/028 (2013.01); B29C 66/73772 (2013.01); G02F 1/3525 (2013.01); H01S 3/0405 (2013.01); H01S 3/0612 (2013.01); H01S 3/0627 (2013.01); H01S 3/113 (2013.01); H01S 3/1643 (2013.01); H01S 3/17 (2013.01); H01S 5/0216 (2013.01); H01S 5/02484 (2013.01); G02F 2001/3505 (2013.01); G02F 2201/50 (2013.01); H01S 3/07 (2013.01); H01S 3/108 (2013.01);
Abstract

A laser component is provided, including a laser medium and a transparent heat transmitting member, at least one of which is oxide. Bonding surfaces of the laser medium and the transparent heat transmitting member are exposed to oxygen plasma, and thereafter the bonding surfaces are brought into contact without heating. The laser medium and the transparent heat transmitting member are bonded at atomic levels, their thermal resistance is low, and no large residual stress is generated due to the bonding taking place under normal temperature. The process of oxygen plasma exposure ensures transparency of their bonding interface. The laser medium and the transparent heat transmitting member are stably bond via an amorphous layer.


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